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APCSCRM 2022
The ambitious Asian-Pacific conference on silicon carbide and related materials
The semiconductor industry faces rapid changes with constantly new challenges. Pureon meets these demands with high-end products and tailormade solutions, especially for ultra-fine surface finishing of silicon carbide (SiC). While SiC promises huge advantages for electrical devices, the manufacturing of SiC wafers puts special challenges to the industry. Are you operating in this fast-growing market and interested in economical and reliable solutions? Then visit Pureon at the APCSCRM 2022 in Xuzhou, China. Our team will be available for you with its comprehensive expertise for two days. Meet Mage Pan and our experts at booth number 33 and discover our solutions and products for the optimum polish for digital worlds.
Highlights at our booth
The glycol-based ready-to-use diamond suspension WSG-52 was developed for high performance multi-wire saw applications. Proprietary additives promote the adhesion of the suspension to the wire and wire web which increases the cutting rate. The stabilized formulation reduces the precipitation of the diamond particles and increases process consistency. The diamond suspension WSG-52 can be tailormade formulated to meet your needs. Our user-friendly stabilized formulation provides a high process reproducibility. In addition, the diamond suspension WSG-52 is distinguished by its ecological-friendly and easy to clean features.
The new IRINO-PRO composite polishing pad closes the gap between lapping on metal plates and polishing on pads. It is best suited for super hard and brittle materials such as sapphire, SiC, ceramics or hard metals. At the same time, IRINO-PRO offers excellent workpiece geometry and flatness without edge rounding. When combining our application-tailored diamond suspensions with IRINO-PRO, surface qualities of up to 1 nm Ra can be achieved! Thanks to the dressable system, it can be applied to double and single side machines. IRINO-PRO is equipped with a self-adhesive backing and can therefore easily be applied to any existing metal carrier plate.
Find us at
Booth number | 33 |
Where | Wyndham Xuzhou East Hotel, China |
When | November 14-16, 2022 |
About APCSCRM
APCSCRM is a high-level forum in the Asia-Pacific region for both, the industry and academia of wide bandgap semiconductors focusing on silicon carbide (SiC) and other wide bandgap semiconductors (GaN, Ga2O3, AlN, etc.). The 2-day conference will take place at Wyndham Xuzhou East Hotel. First held in 2018, APCSCRM will bring together an estimated amount of 400 participants to learn and exchange ideas and new technologies. Its concept of connecting science and economy is very encouraging.
Do you have any further questions?
Please get in touch with us. We are happy to help.
