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The leading global forum for silicon carbide (SiC) and related materials

Rapidly growing markets and constantly improving technology require a lot of attention and know-how. This applies in particular to the semiconductor industry and the ultra-fine surface finishing of silicon carbide (SiC). With Pureon you get a reliable partner along the entire manufacturing process. At the ICSCRM 2022 you have the opportunity to get to know our experts and products in an inspiring environment. Meet us in Davos from September 11th to 16th in room “A Flüela” and dare to step into the future with us.

Highlight at our booth

Pureon has been a pioneer in the development of SiC wafer solutions for over 10 years. Our goal is to develop faster, more efficient and more precise process solutions. We see significant performance improvements after implementing our advanced products. Starting with multi-wire-sawing up to CMP, the holistic product range offers not only economic but also ecological advantages. As a Pureon partner, you benefit from accurate coordination of the manufacturing steps when it comes to surface finishing. This gives you the optimum polish for digital worlds, all from a single source.



Find us at

Booth number R024
Where Congress Centre, Davos
When September 11-16, 2022





The ICSCRM is the leading global forum for silicon carbide (SiC) and related materials. The forum takes place at different locations, most recently in 2019 in Kyoto, Japan. This year the experts will meet in Davos in Switzerland. The topics covered in the 19th ICSCRM include wafer manufacturing, quantum technology, processing, and cross-disciplinary topics.

Do you have any further questions?


Please get in touch with us. We are happy to help.

Angelo Di Nardo

General Manager EMEA Sales