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NALCO™ 2398
Colloidal silica slurry
Colloidal silica for stock removal on silicon:
NALCO™ 2398 is a colloidal silica polishing slurry specifically designed to lower the residual metal levels on wafers after the stock polishing process. The chemical additive package specifically targets copper ions to prevent their transfer into the bulk of the wafer. NALCO™ 2398 produces silicon stock removal rates comparable to NALCO™ 2371, with similar roughness values.
Details
Base material Colloidal silica
Shelf life 12 months
Packaging Standard packaging comes in two sizes: 5 gallon, and 55 gallon. Standard totes also come in two sizes: 264 gallon and 330 gallon. These totes are rigid, virgin, HDPE vessels in an aluminum cage overpack. The openings are six-inch buttress with a two-inch NPT bung with a bottom drain. They can accept dip tubes or other commercially available dispense systems.
Similar products
| NALCO™ 2360 | NALCO™ 2358 | NALCO™ 2371 | NALCO™ 2329 | NALCO™ 2398 | |
|---|---|---|---|---|---|
| Base material | Colloidal silica | Colloidal silica | Colloidal silica | Colloidal silica | Colloidal silica |
| Particle size (µm) | 0.060 | 0.070 | 0.070 | 0.075 | 0.085 |
| pH | 8.5 | 12.0 | 11.8 | 8.4 | 11.8 |
| Solids content | 50 | 28 | 28 | 40 | 28 |
| Specific gravity | 1.39 | 1.19 | 1.19 | 1.29 | 1.19 |
Download
For more detailed information, download our datasheet:
Interested in our colloidal silica slurries?
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