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NALCO™ 2398

Colloidal silica slurry

Colloidal silica for stock removal on silicon:
NALCO™ 2398 is a colloidal silica polishing slurry specifically designed to lower the residual metal levels on wafers after the stock polishing process. The chemical additive package specifically targets copper ions to prevent their transfer into the bulk of the wafer. NALCO™ 2398 produces silicon stock removal rates comparable to NALCO™ 2371, with similar roughness values.


Base material  Colloidal silica

Shelf life  12 months

Packaging  Standard packaging comes in two sizes: 5 gallon, and 55 gallon. Standard totes also come in two sizes: 264 gallon and 330 gallon. These totes are rigid, virgin, HDPE vessels in an aluminum cage overpack. The openings are six-inch buttress with a two-inch NPT bung with a bottom drain. They can accept dip tubes or other commercially available dispense systems.

Similar products

  NALCO™ 2360 NALCO™ 2358 NALCO™ 2371 NALCO™ 2329 NALCO™ 2398
Base material Colloidal silica Colloidal silica Colloidal silica Colloidal silica Colloidal silica
Particle size (µm) 0.060 0.070 0.070 0.075 0.085
pH 8.5 12.0 11.8 8.4 11.8
Solids content 50 28 28 40 28
Specific gravity 1.39 1.19 1.19 1.29 1.19


For more detailed information, download our datasheet:

Interested in our colloidal silica slurries?


We are happy to share our knowledge with you and remain at your disposal for any further questions.

Adam Nielsen

Product Manager Colloidal Silica Slurries