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Urethane CMP pad

The IC1000™ pad is the industry-standard polishing pad for chemical mechanical planarization (CMP). It is made of a rigid, micro-porous polyurethane material. These properties enable the IC1000™ pad to deliver localized planarization, excellent removal rates, low global non-uniformity and low defectivity. The IC1000™ pad works effectively with slurries and conditioners to optimize CMP performance in tungsten, copper, ILD, STI, and polysilicon processes.

Product configuration

Thickness  The standard thickness for an IC1000™ pad is 50 mils, but it is also offered in a thickness of 80 mils if a stiffer pad is required.

Optical endpoint  Window  IC1000™ pads are offered with a transparent urethane window to enable the optical endpoint technology in leading edge CMP tools. Advanced optical endpoint pads feature a window that is bonded to the IC1000™ pad to prevent slurry leakage and window delamination in all CMP processes.

Grooving  IC1000™ pad is offered in a wide variety of grooving patterns across the surface of the pad.  Please consult your local representative for the pattern that will meet the needs of your CMP applications.

Subpads  A compressible subpad improves the global non-uniformity performance of IC1000™ pad. These pads are offered with a variety of subpads depending on the performance needs of the process. SUBA™ IV subpad is the industry standard subpad. SP2000™ subpads are the next generation of subpads, which offer improvements in reliability and performance.


Base material  Urethane

Shelf life  12 months

Packaging  Pads are packaged face-to-face (polish side to polish side) and sealed inside a plastic bag to ensure cleanliness during transportation. The bags are taped to the side of the box to prevent the bag from slipping and damaging the pads. Pads should always remain flat. Bending pads during handling can cause wrinkles in the PSA and premature delamination of the release liner.

Applications  Berylium, germanium, indium phosphide, nickel, polysilicon, sapphire, silicon carbide, tungsten, zinc selenide

Similar products

  IC1000™ IC1010™ CMP IC1010™ CMP with window
Base material Urethane Urethane Urethane
Compressibility % 2.25 2.25 2.25
Hardness 60 57 57
Hardness test Shore D Shore D Shore D
Thickness 50 80 80

The data presented is a statistical representation for comparison purposes. The values are not necessarily a representation of the COA specifications.

IC1000™ is a trademark of DuPont®. Pureon is an authorized distributor for DuPont®.


For more detailed information, download our datasheet:

Interested in our polishing pads for advanced materials?


We are happy to share our knowledge with you and remain at your disposal for any further questions.

Adam Nielsen

Product Manager Polishing Pads for Advanced Materials