Diamond suspension for SiC wafer slicing:
The Glycol-based ready-to-use diamond suspension WSG was developed for high-performance multi-wire saw applications. Proprietary additives promote the adhesion of the suspension to the wire and wire web which increases the cutting rate. The stabilized formulation reduces the precipitation of the diamond particles and increases process consistency. Good lubricating properties help to reduce wire wear. The water-soluble suspension is easy to clean and thus improves serviceability as well as reduces changeover time. Its waterfree, anti-corrosive formulation ensures long service life and excellent machine compatibility.