Electronically plated annealed nickel, with diamond abrasive for ID slicing of silicon ingots and boules:
Semiconductor Materials, Inc (SMI) patented multi-layered diamond ID slicing blades are specifically designed and manufactured to maximize wafer yields in all types of semiconductor materials. The SMI ID Blade and its high speed, creep resistant core materials are specifically manufactured to all higher tensioning, minimizing blade bow, saw marks, and exit chipping.