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ID slicing blades

High quality blades for precision wafering

Electronically plated annealed nickel, with diamond abrasive for ID slicing of silicon ingots and boules:
Semiconductor Materials, Inc (SMI) patented multi-layered diamond ID slicing blades are specifically designed and manufactured to maximize wafer yields in all types of semiconductor materials. The SMI ID Blade and its high speed, creep resistant core materials are specifically manufactured to all higher tensioning, minimizing blade bow, saw marks, and exit chipping.

The Mark III line of ID blades has been designed specifically for slicing silicon ingots, while Mark V is ideal for harder materials such as quartz, sapphire, magnets, and ceramics.


For more detailed information, download our datasheet:

Interested in our consumables for wafering, slicing, and sawing?


We are happy to share our knowledge with you and remain at your disposal for any further questions.

Adam Nielsen

Product Manager Wafering, Slicing, and Wire Sawing