Pureon processes various types of synthetic diamond powders as well as natural diamond powders into a comprehensive array of products in the micron and sub-micron size range. Micron diamond powders are widely used for the superfinishing of hard materials with demanding specifications for surface quality and dimensional accuracy.

We offer a wide range of ready-to-use lapping and polishing slurries in various formulations to fulfill a multitude of requirements. Water-based, oil-based, and glycol-based suspensions or slurries based on aluminum oxide, cerium oxide, colloidal silica and more tailored to the specific application needs make up our extensive portfolio.

For most hand-guided surface finishing operations on complex work pieces, diamond compounds are used to achieve the final surface finish. Pureon offers a comprehensive range of diamond compounds with a choice of different carriers, diamond types and packaging options.

A complete range of easy-to-use diamond grinding pads for fine grinding applications. All our diamond grinding pads are made with our precision graded micron diamond sizes. With pads for a number of different applications that come with a choice of different mounting options, diamond sizes and pad diameters, we have you covered whatever your requirements.

Pureon's range of polishing pads includes pads for pre-polishing, polishing, fine polishing, and superfinishing with both diamond as well as CMP slurries. We complete our offering with high performance diamond suspensions and are pleased to assist you in selecting the best-suited combination of diamond suspension and polishing pad to achieve best process results.

Coolants and lubricants are generally used to optimize removal rate and surface finish in grinding, sawing, and dicing processes using diamond grinding wheels and blades. These products maintain a clear diamond matrix, and exceptional heat transfer characteristics ensure prolonged diamond life, even with the most difficult materials.

Backing films and templates from Pureon are an easy-to-use alternative to the wax mounting technique, with simple installation and clean-up. Ideal for customers who polish a variety of different sizes or unusually shaped substrates.

Achieve a consistent and reliable slicing process and make multiple wafers from continuous ingots or boules with our consumables for wafering, slicing and wire sawing. We offer diamond suspensions, ingot slicing beams, ingot mounting adhesives, and slicing blades.

Aqueous detergents for superior cleaning and particle removal engineered to increase the cavitational energy released upon substrate surfaces for more effective cleaning. These products are typically used to remove post-process residues after grinding, slicing, lapping, etching and polishing.