At its core, CMP embodies a harmonious amalgamation of scientific principles and engineering ingenuity. It involves the simultaneous application of chemical and mechanical forces to meticulously remove material from a substrate surface. The chemical slurry, enriched with abrasive particles, interacts with a rotating polishing pad, creating a dynamic interface that refines surfaces with exceptional precision.
Immersed in versatility, CMP adapts effortlessly to the unique characteristics of each material. We embrace the challenge of tailored material removal, enabling simultaneous, precision polishing of multiple materials.