Introducing the IRINO-PROSiC composite polishing pad, a cutting-edge addition to our IRINO family of composite polishing pads. Specifically engineered for the polishing of Silicon Carbide (SiC), IRINO-PROSiC is designed
to deliver superior results in SiC DMP (Direct Mechanical Planarization) processes.

When paired with the suspension PURE-DS-RT, IRINO-PROSiC excels in the Rapid Thinning process, offering a highly competitive alternative to traditional SiC DMP grinding methods. This innovative combination not only achieves
exceptional surface quality but also ensures impressive stock removal rates, making it ideal for applications requiring a smooth transition directly to CMP (Chemical Mechanical Planarization).

With its self-adhesive backing, IRINO-PROSiC can be effortlessly applied to any existing metal carrier plate, enhancing ease of use and efficiency in
SiC polishing applications. Whether you seek high surface quality or superior material removal, IRINO-PROSiC is the optimal choice for advanced SiC processing.