Pre-polishing, fine polishing, super fine polishing, superfinishing, CMP polishing: Pureon offers a broad range of polishing pads suitable for a wide range of materials. The pad geometries and surfaces are optimized for high stock removal and superior surface finish making our pads versatile in most advanced applications.
Polishing pads for advanced materials
For the advanced materials sector, Pureon’s large product offering services a wide variety of materials including specialty substrates, semiconductor wafers, glass, ceramics, special metals, and plastics. All pad raw materials are manufactured by DuPont Advanced Materials with strict manufacturing process controls intended for use in semiconductor applications.
The novel composite polishing pads from Pureon are closing the gap between lapping and polishing and are positioned to achieve the best of both worlds. The pads are made up of a polymer matrix with embedded metal powders and, when charged with diamond suspension, they achieve high stock removal rates with a fine surface finish. These pads are ideal for super hard and brittle materials such as Sapphire, SiC, engineered ceramics, and hard metals.
Pureon polishing pads for industrial applications are suitable for machine as well as manual processing. They are also used in the field of metallography as well as for mobile polishing with hand pieces. The scope of applications extends from pre-polishing to final polishing.