IC1000™ pad is the industry-standard polishing pad for chemical mechanical polishing (CMP). The IC1000™ pad is made of a rigid, micro-porous polyurethane material. These properties enable the IC1000™ pad to deliver localized planarization, excellent removal rates, low global non-uniformity and low defectivity. The IC1000™ pad works effectively with slurries and conditioners to optimize CMP performance in tungsten, copper, ILD, STI, and polysilicon processes.