IC1000™ pad is the industry-standard polishing pad for chemical mechanical polishing (CMP). The IC1000™ pad is made of a rigid,
micro-porous polyurethane material. These properties enable the IC1000™ pad to deliver localized planarization, excellent removal rates,
low global non-uniformity and low defectivity. The IC1000™ pad works efectively with slurries and conditioners to optimize CMP
performance in tungsten, copper, ILD, STI, and polysilicon processes.