Lapping and Polishing Slurries

PURE-DS-RT

Glycol-based diamond suspension

PURE-DS-RT suspensions are fully water-soluble but do not dry when exposed to air. The excellent lubrication properties of PURE-DS-RT allow for high lapping pressures and thus high removal rates.

PURE-DS-RT suspensions are ideal for Rapid Thinning of SiC wafers and of hard materials (e.g. sapphire).

Highlights

Specifically designed
for the use with IRINO

User-friendly thanks to stabilized formulation

Perfect suspension for Pureon’s Rapid Thinning process

Environmentally friendly and easy to clean

Good lubrication

Tight particle size distribution

Product Specifications

Carrier liquid

Water-soluble

Density

1.00 g/cm3

Typical lapping plate

metal lapping plate, polishing pad
(check compatibility)

Product Specifications

Base material

Water

Shelf life

24 months

Applications

Ceramic, fused silica,
glass, poly carbonate lens

Type Workpiece type Workpiece size Plate type Application
PURE-DS-RT-1 SiC (4H-N) 150 mm, 200 mm IRINO-PROSiC SiC Rapid Thinning, High-Performance
PURE-DS-RT-2 SiC (4H-N) 150 mm, 200 mm IRINO-PROSiC SiC Rapid Thinning, High-Quality
PURE-DS-RT-3 Sapphire, A-plane, C-plane 30 mm, 50 mm IRINO-PRO-H Sapphire Rapid Thinning, High-Performance
PURE-DS-RT-4 Sapphire, A-plane, C-plane 30 mm, 50 mm IRINO-PRO-M Sapphire Rapid Thinning, High-Quality
PURE-DS-RT-5 Ferrous metals 25 mm, 40 mm, 50 mm IRINO-PLUS-H Ferrous metal, Rapid Thinning High-Performance
PURE-DS-RT-6 Ferrous metals 25 mm, 40 mm, 50 mm IRINO-PLUS-M Ferrous metal, Rapid Thinning High-Quality

Interested in PURE-DS-RT?

We are happy to share our knowledge with you
and remain at your disposal for any further questions.

Portrait Ueli Siller, General Manager Switzerland

Ueli Siller