Semiconductor Materials, Inc (SMI) patented multi-layered diamond ID slicing blades are specifically designed and manufactured to maximize wafer yields in all types of semiconductor materials. The SMI ID Blade and its high speed, creep resistant core materials are specifically manufactured to all higher tensioning, minimizing blade bow, saw marks, and exit chipping.

The Mark III line of ID blades has been designed specifically for slicing silicon ingots, while Mark V is ideal for harder materials such as quartz, sapphire, magnets, and ceramics.