Wafering, slicing, and wire sawing

ID Slicing Blades

Electronically plated annealed nickel, with diamond abrasive

Semiconductor Materials, Inc (SMI) patented multi-layered diamond ID slicing blades are specifically designed and manufactured to maximize wafer yields in all types of semiconductor materials. The SMI ID Blade and its high speed, creep resistant core materials are specifically manufactured to all higher tensioning, minimizing blade bow, saw marks, and exit chipping.

The Mark III line of ID blades has been designed specifically for slicing silicon ingots, while Mark V is ideal for harder materials such as quartz, sapphire, magnets, and ceramics.


Manufactured exclusively with 100 % natural DeBeers diamonds

Available in outer diameters ranging from 8” up
to 34”

Custom-made blades available upon request

Product Specifications

Carrier material

Carrier material

Shelf life



Ceramic, sapphire, silicon, quartz

Interested in our
ID Slicing Blades?

We are happy to share our knowledge with you
and remain at your disposal for any further questions.

Adam Nielsen