Ultrasonic/megasonic detergents are engineered to increase the cavitational energy released upon substrate surfaces, resulting in more effective cleaning. Used at economical dilution ratios, these products will remove light organics and sub-micron particles. They are typically used to remove post-process residues after grinding, slicing, lapping, etching, and polishing.
These advanced cleaning solutions are specifically formulated to be compatible with a wide range of materials, including silicon, sapphire, and compound semiconductors, minimizing the risk of surface damage.
We are happy to share our knowledge with you and remain at your disposal for any further questions.