Grinding pads

SQUADRO-M/H

Diamond Grinding Pad

SQUADRO-M and SQUADRO-H are innovative diamond grinding pads that extends fine grinding to single-micron grit sizes. They replace conventional lapping processes, achieving superior results in terms of material removal rate, surface quality, workpiece geometry and tool life. SQUADRO diamond grinding pads provide for an easy, clean and efficient fine grinding process.

Highlights

Suited for all common glass material

More economic than abrasive foil or slurries

High planarity and precise edges

Longer life time than abrasive foil

Clean operation because no abrasive slurry is needed

Product specifications

Diameter

200 – 760 mm

one-piece for bigger diameters multi-piece

Diamond size

3 μm, 6 μm,
15 μm, 30 μm,
45 μm, 60 μm

(125 μm only SQUADRO-H)

Abrasive layer
thickness

0.4 mm,

optional 0.8 mm

Bond type

resin, triangular structure

SQUADRO-M:
Resin, medium hard
SQUADRO-H: Resin, hard

Carrier material

textile base

Backing / mounting

stainless
steel carrier
/ self-adhesive (PSA)

thisistest

thisistest

Diameter Grit Size
200 mm 125 micron
250 mm 125 micron
300 mm 125 micron

thisistest
200 mm 54 micron
250 mm 54 micron
300 mm 54 micron
200 mm 10 micron
250 mm 10 micron
300 mm 10 micron
200 mm 75 micron
250 mm 75 micron
300 mm 75 micron

Product Specifications

Carrier material

Water + Oil

Abrasive

100 %
diamond

Applications

For many materials

Interested in our
SQUADRO-M/H Grinding Pad?

We are happy to share our knowledge with you and remain at your disposal for any further questions.

Dipl.-Ing. Helge Willers

Download Datasheet