The polymer formulation IKONIC™ 4250L delivers a high removal rate. It also meets the surface roughness requirements for 200 mm
SiC wafers. The controlled porosity and tight distribution of the pore size results in longer pad lifetime. The pad formulation IKONIC™
4250L also ofers the possibility for longer lifetime due to lower cut rates with pad conditioning. The pad is with or without subpad.
Slurry-reduction grooving options are available to lower slurry consumption and reduce costs.