Seminar for modern grinding technology in Stuttgart Pureon presents application-specific solutions in the field of ultra-fine machining
Seminar for modern grinding technology in Stuttgart Pureon presents application-specific solutions in the field of ultra-fine machining
At the beginning of May, the Competence Center for Machining Technology (KSF) once again hosted the seminar “Modern Grinding Technology and Superfinishing” in Stuttgart (Germany). At the largest event in this field, participants from science and industry learned about the latest developments in grinding technology and ultra-fine machining. Speakers from Germany and abroad reported on the latest research. In addition to a large number of companies, Pureon, a provider of technologically leading solutions for the surface processing of high-tech materials, also took the opportunity to present its own products and processes.
Dr. Jentgens, what trends do you currently see in the field of grinding technology and ultra-fine machining?
Classic grinding technology is very well developed. In addition, there are more and more questions and challenges regarding the machining of artificial and ceramic hard materials, but also of modern, crystalline semiconductor materials. Examples include both generally pure oxide ceramics and the combination of various metal oxides, nitride ceramics – such as silicon nitrides – or non-crystalline silicon carbide. In addition, the focus in the future will be even more on semiconductor materials such as crystalline silicon carbide, gallium nitride, gallium oxide or indium phosphide. A new trend in the semiconductor industry is CVD coating. Chemical vapor deposition is a vacuum process used to produce high-quality, high-performance thin films.
In your opinion, what opportunities and challenges do these trends bring?
Many of the materials mentioned are hard materials that are difficult to machine using conventional grinding technology. Therefore, one cannot avoid using diamond-based tools. In addition, the number of material combinations, each of which has very specific properties and machining requirements, is constantly increasing. For us as a company that offers technologically leading solutions for the surface processing of high-tech materials, this is a great opportunity: Pureon offers its customers a fully integrated product range for the most demanding applications: from diamond powder to lapping and polishing suspensions to diamond fine grinding wheels.
What solutions exactly does Pureon offer its customers in this market?
Typically, the materials mentioned have to be processed via a sequence of process steps. This means that shaping first takes place by means of cutting or sawing, followed by rough grinding. Subsequently, grinding traces are worked out via lapping processes before moving on to polishing processes. Pureon offers products for all these process steps. The challenge at this point is to coordinate the individual process steps well and efficiently.
What products and solutions did Pureon exhibit or present at the grinding technology seminar?
Due to the large number of possible materials and the multi-stage machining process, Pureon exhibited exemplary products that are suitable for the respective process steps. We always work out explicit process solutions and specific requirements individually with the respective customer. However, in the area of glass processing – with more recurring issues – Pureon presented a recently developed diamond fine grinding wheel.
