Developed as an alternative to the original DF200 material, the PF800 is an advanced new standard with application in many industries, including semiconductor, optics, and specialty substrates. The PF800 is a poromeric film buffed such that it has an open, tube-like pore structure. This structure compresses to absorb flatness variations on both the back-side of the wafer, as well as the polishing head itself. In addition, it will rebound to its original thickness over a long period of time, producing grater flatness throughout the lifetime of the film. Finally, the film features superior flatness results when used in a template, as wafers held in place by water tension are still able to rotate within the pocket.

When used as a final polishing pad, the PF800 construction quality yields excellent surface finish, lifetime, and flatness.

PF800 is also commonly used as gasket material or a carrier film. It is easily cut to any size, and laser-cut vacuum holes may also be implemented.