Grinding pads

APOLLO-S

Resin-bond diamond grinding pad

APOLLO-S is a self-sharpening, flexible diamond grinding pad for flat- and fine grinding applications, replacing traditional SiC paper pad in grinding of various materials. Precision graded diamond and optimized grit concentration lead to short process times, flat surfaces and superior edge sharpness.

Highlights

Enables short process times, flat surfaces and superior edge sharpness

Allows high material removal rates and excellent surface qualities

Prevents corrosion

Product Specifications

Carrier material

15 m/s

Grinding pressure

5 – 7 N/cm2

for steel and comparable materials

13 N/cm2

for ceramics

Coolant

Water

Typical application

Rough and fine grinding of non-metallic samples, embedded and non embedded samples

Examples

Backing film Compression Deflection TTV
200 mm 125 Mikron 200 mm 54 Mikron
250 mm 125 Mikron 250 mm 54 Mikron
300 mm 125 Mikron 250 mm 54 Mikron
350 mm 125 Mikron 350 mm 54 Mikron
400 mm 125 Mikron 400 mm 54 Mikron

thisistest

thisistest
200 mm 75 Mikron 200 mm 18 Mikron
250 mm 75 Mikron 250 mm 18 Mikron
300 mm 75 Mikron 250 mm 18 Mikron
350 mm 75 Mikron 350 mm 18 Mikron
400 mm 75 Mikron 400 mm 18 Mikron

Examples

Backing film Compression Deflection TTV
200 mm 125 Mikron 200 mm 54 Mikron
250 mm 125 Mikron 250 mm 54 Mikron
300 mm 125 Mikron 250 mm 54 Mikron
350 mm 125 Mikron 350 mm 54 Mikron
400 mm 125 Mikron 400 mm 54 Mikron

thisistest
200 mm 75 Mikron 200 mm 18 Mikron
250 mm 75 Mikron 250 mm 18 Mikron
300 mm 75 Mikron 250 mm 18 Mikron
350 mm 75 Mikron 350 mm 18 Mikron
400 mm 75 Mikron 400 mm 18 Mikron

Product Specifications

Carrier material

Water + Oil

Abrasive

100 %
diamond

Applications

For many materials

Interested in our
APOLLO-S Grinding Pad?

We are happy to share our knowledge with you and remain at your disposal for any further questions.

Dipl.-Ing. Helge Willers

Download Datasheet