Grinding pads

SQUADRO-O/OWH

Diamond Grinding Pad

SQUADRO-O and SQUADRO-OWH are diamond grinding pads specially optimized for fine grinding of optical components. Manufactured using high-precision diamond micron sizes in a self-sharpening bond, SQUADRO-O and SQUADRO-OWH achieve excellent surface quality, exact geometry and very high removal rates. The grinding pads can be used for both flat or spherical optical components and provide easy, clean and efficient processes.

Highlights

Product specifications

Diameter

200 – 760 mm

one-piece for bigger diameters multi-piece

Diamond size

SQUADRO-OWH

1 μm, 2 μm
and 3 μm

SQUADRO-O

6 μm,
15 μm, 30 μm
and 60 μm

Abrasive layer
thickness

0.2 mm
and 0.4 mm

More economic than abrasive foil or slurries

High planarity and precise edges

Longer life time than abrasive foil

Clean operation because no abrasive slurry is needed

Bond type

resin

SQUADRO-M:
Resin, medium hard
SQUADRO-H: Resin, hard

Carrier material

textile base

Backing / mounting

self-adhesive
(PSA)

thisistest

thisistest

Diameter Grit Size
200 mm 125 micron
250 mm 125 micron
300 mm 125 micron

thisistest
200 mm 54 micron
250 mm 54 micron
300 mm 54 micron
200 mm 10 micron
250 mm 10 micron
300 mm 10 micron
200 mm 75 micron
250 mm 75 micron
300 mm 75 micron

Product Specifications

Carrier material

Water + Oil

Abrasive

100 %
diamond

Applications

For many materials

Interested in our
SQUADRO-O/OWH grinding pad?

We are happy to share our knowledge with you and remain at your disposal for any further questions.

Dipl.-Ing. Helge Willers

Download Datasheet