Grinding pads

SQUADRO-O/OWH

Diamond Grinding Pad

SQUADRO-O and SQUADRO-OWH are diamond grinding pads specially optimized for fine grinding of optical components. Manufactured using high-precision diamond micron sizes in a self-sharpening bond, SQUADRO-O and SQUADRO-OWH achieve excellent surface quality, exact geometry and very high removal rates. The grinding pads can be used for both flat or spherical optical components and provide easy, clean and efficient processes.

Highlights

More economic than abrasive foil or slurries

High planarity and precise edges

Longer life time than abrasive foil

Clean operation because no abrasive slurry is needed

Product specifications

Diameter

200 – 760 mm

one-piece for bigger diameters multi-piece

Diamond size

SQUADRO-OWH

1 μm, 2 μm
and 3 μm

SQUADRO-O

6 μm,
15 μm, 30 μm
and 60 μm

Abrasive layer
thickness

0.2 mm
and 0.4 mm

Bond type

resin

SQUADRO-M:
Resin, medium hard
SQUADRO-H: Resin, hard

Carrier material

textile base

Backing / mounting

self-adhesive
(PSA)

Interested in our
SQUADRO-O/OWH grinding pad?

We are happy to share our knowledge with you and remain at your disposal for any further questions.

Dipl.-Ing. Helge Willers

Download Datasheet