Lapping and Polishing Slurries

OWS

Glycol-based diamond suspension

Water soluble suspension designed for lapping and polishing of ceramic and metals. The product is widely used for finishing of sapphire, ruby, silicon carbide, tungsten carbide and other super hard materials. OWS suspension is fully water-soluble but does not dry up when exposed to air. This makes it a perfect product to replace oil-based polishing fluids. The excellent lubrication properties of OWS allow for high lapping pressures and thus high removal rates.

Highlights

Highly tailor-made: select any diamond type, grit size and concentration

User-friendly thanks to stabilized formulation

Environmentally friendly and easy to clean

Scratch-free polishing also in submicron range

Guaranteed agglomerate-free

Product Specifications

Carrier liquid

Water-soluble

Density

1.00 g/cm3

Typical lapping plate

metal lapping plate, polishing pad
(check compatibility)

Product Specifications

Base material

Water

Shelf life

24 months

Applications

Ceramic, fused silica,
glass, poly carbonate lens

Suspension type Viscosity Stability pH value
OWS-220 750 cP stabilized 7.5
OWS-320 9’000 cP stabilized 7.5
OWS-1150 gel-like stabilized 7.5

Interested in our
slurry products and solutions?

We are happy to share our knowledge with you and remain at your disposal for any further questions.

Adam Nielsen