Lapping and Polishing Slurries

SPG

Glycol-based diamond suspension

SPG suspensions are fully water-soluble but do not dry when exposed to air. This makes SPG a perfect product to replace oil-based polishing fluids. The excellent lubrication properties of SPG allow for high lapping pressures and thus high removal rates. SPG suspensions are ideal for use with metal lapping/polishing plates (steel, copper, tin, composites). Verify compatibility if used with polishing pads.

Highlights

Highly tailor-made: select any diamond type, grit size and concentration

User-friendly thanks to stabilized formulation

Environmentally friendly and easy to clean

Good lubrication

Tight particle size distribution

Product Specifications

Carrier liquid

Water-soluble

Density

1.00 g/cm3

Typical lapping plate

metal lapping plate, polishing pad
(check compatibility)

Product Specifications

Base material

Water

Shelf life

24 months

Applications

Ceramic, fused silica,
glass, poly carbonate lens

Type Viscosity pH Density [g/cm³] Properties Application / remarks
SPG-10 60 cP 11.0 1.0 – 1.1 stabilized water-soluble for copper plates (environmentally friendly)
SPG-50 40 cP 11.5 1.0 – 1.1 stabilized water-soluble for general applications on a variety of materials
SPG-100 275 cP 8.3 1.0 – 1.1 stabilized water-soluble perfect match with IRINO composite polishing pads
SPG-120 150 cP 9.0 1.0 – 1.1 stabilized water-soluble for tin plates

Interested in our
slurry products and solutions?

We are happy to share our knowledge with you and remain at your disposal for any further questions.

Adam Nielsen

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