For multi-wafer batch processing, the EXTERION™ N4000H polishing pads are formulated to meet the demands of SiC polishing applications.
The EXTERION™ pad line uses a new advanced urethane formula specifically to achieve higher removal rates and lower pad wear. The controlled porosity and tight distribution of the pore size result in longer pad lifetime. The EXTERION™ N4000H pad is available without sub-pad, and XY-Grooving for optimal slurry distribution for the large diameter platens.