Wafering, slicing, and wire sawing


Glycol-based diamond suspension

The glycol-based ready-to-use diamond suspension WSG was developed for high performance multi-wire saw applications. Proprietary additives promote the adhesion of the suspension to the wire and wire web which increases the cutting rate. The stabilized formulation reduces the precipitation of the diamond particles and increases process consistency.

Good lubricating properties help to reduce wire wear. The water-soluble suspension is easy to clean and thus improves serviceability as well as reduces changeover time. Its water-free, anti-corrosive formulation ensures long service life and excellent machine compatibility


Highly tailor-made select any diamond type, grit size and concentration

Excellent adherence to cutting wire

User-friendly stabilized formulation for high process reproducibilit

cutting rate

Water-free, anti-corrosive formulation

Environmentally friendly and easy to clean

Product Specifications

Carrier material



1.05 g/cm³

Typical diamond
types / sizes

0.4 mm,

optional 0.8 mm

Typical diamond concentration

250 cts/l,
500 cts/

Typical application

saw cutting

Suspension type Viscosity Stability pH value
WSG-52 90 cP stabilized 5.8
WSG-56 60 cP partially stabilized 8.3

Interested in our
WSG Diamond Suspension?

We are happy to share our knowledge with you
and remain at your disposal for any further questions.

Adam Nielsen