Polishing Pads

IRINO-PRO-C

Composite polishing pad,
copper-resin matrix

Composite polishing pad for lapping and polishing of Sapphire, SiC and technical ceramic
The novel IRINO-PRO-C composite polishing pad is closing the gap between lapping on metal plates and polishing on pads. It is most suitable for lapping and polishing of superhard materials such as sapphire, SiC, tungsten carbide and ceramics. Combined with application-tailored diamond suspensions from Pureon, IRINO-PRO-C allows for high surface qualities and impressive stock removal rates at the same time. The polishing pad comes with a self-adhesive backing. As such, it can be applied to any existing metal carrier plate, which makes it very user-friendly.

Highlights

Innovative polishing pad combines lapping and polishing principles

Dressable system, suitable for single-side and double-side machines

Surface finishes down to 1 nm Ra

Best results if used with water-soluble or oil-based diamond suspensions from Pureon

Material removal rates similar to soft metal lapping plates

Provides excellent workpiece geometry and Flatness, without edge round-off

Product specifications

Diameter

200
– 760 mm

one-piece, larger than 760 mm multi-piece

Hardness

60 – 65
Shore D

Layer thickness

1.0
or 1.6 mm

Matrix

Copper resin

Applications

Stock removal or polishing of sapphire and ceramics

Base

Polycarbonate,
self-adhesive backing

Performance IRINO-PRO

Sapphire wafer

thisistest

thisistest

Diameter Grit Size
200 mm 125 micron
250 mm 125 micron
300 mm 125 micron

thisistest
200 mm 54 micron
250 mm 54 micron
300 mm 54 micron
200 mm 10 micron
250 mm 10 micron
300 mm 10 micron
200 mm 75 micron
250 mm 75 micron
300 mm 75 micron

Product Specifications

Carrier material

Water + Oil

Abrasive

100 %
diamond

Applications

For many materials

Interested in our
IRINO-PRO-C Polishing Pad?

We are happy to share our knowledge with you
and remain at your disposal for any further questions.

Dipl. Ing. Helge Willers

Download Datasheet