New Scientific Publication: Pureon Contributes to Open-Access Book on Semiconductor Technology
New Scientific Publication: Pureon Contributes to Open-Access Book on Semiconductor Technology
Open-access publications play a crucial role in making education and scientific knowledge accessible to researchers, professionals, and the wider public around the world. Recently, Pureon contributed a chapter to an open-access book published by IntechOpen, one of the world’s leading publishers of peer-reviewed academic books. Founded in 2004 and based in London, IntechOpen provides a global platform for researchers and industry experts to share cutting-edge knowledge. Discover how Pureon’s innovative Rapid Thinning process is shaping the future of SiC wafer manufacturing – boosting efficiency, quality, and scalability for next-generation semiconductor applications.
Sharing Expertise in Surface Finishing for Next-Gen Semiconductors
Pureon is proud to contribute a technical chapter to “Silicon Carbide – Materials, Devices and Emerging Applications”, the open-access publication from IntechOpen. Our chapter, “Rapid Thinning in SiC Wafering: Innovations and Impacts on the Value Chain”, offers deep insight into precision surface finishing technologies critical to modern semiconductor manufacturing – particularly for silicon carbide (SiC) wafers.
Why Surface Finishing Matters in SiC Wafer Processing
With the transition to wide-bandgap materials, device performance is increasingly sensitive to surface quality. The chapter focuses on how advanced grinding, lapping, and chemo-mechanical polishing (CMP) processes influence key quality parameters:
- Total Thickness Variation (TTV)
- Sub-Surface Damage (SSD)
- Surface roughness
- Defectivity and particle control
We share both theoretical background and empirical data, showing how Pureon’s engineered consumables and the Rapid Thinning process enable tighter process control, higher wafer yield, and improved downstream performance.
A Bridge Between R&D and Scalable Manufacturing
This publication highlights Pureon’s role in translating research insights into scalable, industry-ready solutions. Our contribution is designed for process engineers, R&D professionals, and semiconductor technologists looking to optimize materials like SiC for power and RF applications.
As demand grows for smaller nodes, higher power density, and energy efficiency, surface finishing becomes a strategic enabler—not just a polishing step.
Access the Chapter
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